Ball Grid Array
Ceramic Ball Grid Array
Glass-Sealed Ceramic Dual In-Line Package
Side-Braze Ceramic Dual In-Line Package
Both Formed and Unformed CFP
Ceramic Pin Grid Array
Ceramic Zig-Zag Package
Description of package type.
Dual Flat Package
Flip Chip / Chip Scale Package
Thermally Enhanced Low Profile QFP
Thermally Enhanced Quad Flat Package
Thermally Enhanced Small-Outline Package
Thermally Enhanced Thin Quad Flat Pack
Thermally Enhanced Thin Shrink Small-Outline Package
Thermally Enhanced Very Thin Quad Flat Package
The JEDEC Standard for this package type.
J-Leaded Ceramic or Metal Chip Carrier
Leadless Ceramic Chip Carrier
The length of the device (in millimeters).
Land Grid Array
Low Profile Quad Flat Pack
The maximum height above board surface form (in millimeters).
Plastic Dual-In-Line Package
Plastic Flange Mount Package
Package designator code used in Texas Instruments part numbers. The link from the Pkg code goes to the package mechanical drawing in PDF format. Each of the PDF files is between 30K and 50K Bytes.
The number of pins or terminals on the package.
The distance between the centers of adjacent pins (in millimeters).
||- Preferred Package. Package is qualified and orderable.|
||- Use if a preferred package is not available|
||- Requires department/business unit approval.|
||- Not recommended for new designs.|
||- Do not use. No longer supported. Not qualified. No longer tooled.|
Quad Flat Package
J-Leaded Small-Outline Package
Small-Outline Package (Japan)
Shrink Small-Outline Package
Triple Flat Pack
Thin Quad Flat Package
Thin Shrink Small-Outline Package
Thin Very-Fine Land Grid Array
Very Thin Small-Outline Package
The maximum thickness of the package body (in millimeters).
The abbreviated acronymn for this type of package.
Very Thin Quad Flat Package
The width of the device (in millimeters).